|
5.5. Sensors-Circuits Co-integration
A number of the sensors detailed above were directly fabricated using processing steps of the SOI CMOS fabrication flow used for ICs, or introducing steps which are compatible with CMOS fabrication, either before, during or after this CMOS process. SOI substrates indeed offer a lot of advantages toward the joint fabrication of sensors and CMOS circuits.
In conclusion, SOI profiles as a mature solution for heterogeneous systems or micro-systems, since it permits, from room to elevated temperature, low-voltage low-power up to high-frequency performance, VLSI integration of analog, digital, sensors and MEMS with enhanced performance, process simplicity and scalability, compatibility of modeling/design/CAD tools with standard bulk CMOS and better noise immunity.
|
|
|
